Hua Hong Grace Semiconductor Limited (1347.HK). Dividend Frequency: annual. The latest recorded dividend from Hua Hong Grace Semiconductor Limited was HK$0.17 per share. Last ex-date: June 3, 2024. The last dividend payment from Hua Hong Grace Semiconductor Limited was made on June 26, 2024. The current dividend yield of Hua Hong Grace Semiconductor Limited is 0%.
Past
Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.
Date
Amount
Change
HK$0.17
-
Jun 26, 2024
HK$0.17
-46.77%
HK$0.31
-
Jun 26, 2019
HK$0.31
-
HK$0.31
+3.33%
Jun 14, 2018
HK$0.31
+3.33%
HK$0.30
+11.11%
Jun 16, 2017
HK$0.30
+11.11%
HK$0.27
-
Jun 30, 2016
HK$0.27
-
10Y Growth
0%
5Y Growth
0%
3Y Growth
0%
1Y Growth
0%
Community
FAQs
What is the dividend yield of Hua Hong Grace Semiconductor Limited?▼
The current dividend yield of Hua Hong Grace Semiconductor Limited is 0%.
How safe is the dividend of Hua Hong Grace Semiconductor Limited?▼
Hua Hong Grace Semiconductor Limited's dividend profile shows a payout ratio of 4.75%.
What is the dividend of Hua Hong Grace Semiconductor Limited?▼
The latest recorded dividend from Hua Hong Grace Semiconductor Limited was HK$0.17 per share.
When did I have to buy the shares of Hua Hong Grace Semiconductor Limited to receive the previous dividend?▼
To receive the previous dividend from Hua Hong Grace Semiconductor Limited, you needed to own the shares before the ex-dividend date of June 3, 2024.
When did Hua Hong Grace Semiconductor Limited pay the last dividend?▼
The last dividend payment from Hua Hong Grace Semiconductor Limited was made on June 26, 2024.