Stock Events

Qifu Technology (3660.HK) Dividends 2024

3660.HK -3.20%
Dividend Yield
3.63%
Dividend amount
HK$2.33
Last ex-date
Sep 26, 2024
Last pay date
Oct 29, 2024

Summary

Qifu Technology (3660.HK) dividends are paid semi-annual. The latest dividend per share was HK$2.33 with an ex date of September 26, 2024 and a payment date of October 29, 2024. The next dividend per share will be HK$2.27 with an ex date of April 12, 2025 and a payment date of May 21, 2025. The curreny dividend yield of Qifu Technology (3660.HK) is 3.63%.

Upcoming

12
APR 25
Dividend Ex
Estimated
 
21
MAY 25
Dividend Payment
Estimated
 
26
SEP 25
Dividend Ex
Estimated
 
29
OCT 25
Dividend Payment
Estimated
 
12
APR 26
Dividend Ex
Estimated
 
21
MAY 26
Dividend Payment
Estimated
 
26
SEP 26
Dividend Ex
Estimated
 
29
OCT 26
Dividend Payment
Estimated
 

Past

Oct 24
HK$2.33
May 24
HK$2.27
Oct 23
HK$1.96
May 23
HK$0.63
Jan 23
HK$0.62
10Y Growth
N/A
5Y Growth
N/A
3Y Growth
N/A
1Y Growth
78.32%