Winbond Electronics 

TWD91
6
-TWD4.6-4.81% 今天

統計

當日最高
96.2
當日最低
90.3
52週高點
136
52週低點
13.6
成交量
135,141,692
平均成交量
171,347,142
市值
409.5B
本益比
101.59
股息殖利率
0.52%
股息
0.48

即將到來

股息

0.52%股息殖利率
May 26
TWD0.5
Oct 23
TWD1
Jul 22
TWD1
Jul 21
TWD0.2
Jul 20
TWD0.1
10年成長
17.46%
5年成長
20.11%
3年成長
-20.63%
1年成長
不適用

財報

30Apr預期
Q3 2024
Q4 2024
Q1 2025
Q2 2025
Q3 2025
Q4 2025
下一步
-0.3
0.46
1.21
1.96
預期EPS
1.9641844209746906
實際EPS
不適用

財務

4.43%利潤率
有盈利
2020
2021
2022
2023
2024
2025
178.81B營收
7.92B淨利

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此清單是根據在 Stock Events 上追蹤 2344.TW 的使用者自選建立的。這不是投資建議。

競爭對手

此清單為基於近期市場事件的分析。並非投資建議。

關於

Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM products; code storage flash memory products comprising serial NOR, 1.2V serial NOR, octal NOR, QspiNAND, OctalNAND, SLC NAND, NAND based MCP, SpiStack, and authentication flash products; TrustME secure flash memory, such as secure flash memory, and secure memory elements; and logic IC products. In addition, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6-inch wafer fab production, testing, and foundry services; E-commerce and investment business; semiconductor component design and marketing services; smart factory solutions; semiconductor-related hardware and software system integration design; design, research, testing, sales, and service of integrated circuits and auxiliary equipment; develops automotive and industrial control software and services; customer service and technical support; computer software services; computers and peripherals, and software wholesale; repair, testing, and related technical consulting services; and rental of semiconductor-related equipment. It markets its products through distributors and online. The company's products are used in computer, communication, consumer, automotive, and industrial electronics. Winbond Electronics Corporation was incorporated in 1987 and is headquartered in Taichung, Taiwan.
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執行長
Mr. Pei-Ming Chen MSEE
國家
TW
ISIN
TW0002344009

上市

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FAQ

Winbond Electronics 今天的股價是多少?
2344.TW 目前價格為 TWD91 TWD,過去 24 小時下跌了 -4.81%。在圖表上更密切關注 Winbond Electronics 股票的表現。
Winbond Electronics 的股票代號是什麼?
根據交易所不同,股票代號可能會有所差異。例如,在 交易所,Winbond Electronics 的股票以代號 2344.TW 進行交易。
Winbond Electronics 的股價在上漲嗎?
2344.TW 股票較上週下跌 -0.87%,本月下跌 -9.9%,但在過去一年中,Winbond Electronics 上漲了 +564.23%。
Winbond Electronics 的市值是多少?
今天 Winbond Electronics 的市值為 409.5B
Winbond Electronics 下一次財報日期是什麼時候?
Winbond Electronics 將於 April 30, 2026 公布下一次財報。
Winbond Electronics 上一季度的財報如何?
2344.TW 上一季度的財報為每股 0.76 TWD,預估為 0.81 TWD,帶來 -5.57% 的驚喜。下一季度的預估財報為每股 不適用 TWD。
Winbond Electronics 去年的營收是多少?
Winbond Electronics 去年的營收為 178.81BTWD。
Winbond Electronics 去年的淨利是多少?
2344.TW 去年的淨收益為 7.92BTWD。
Winbond Electronics 會發放股息嗎?
是的,2344.TW 的股息每 年度 發放一次。每股最新股息為 1 TWD。截至今日,股息殖利率(FWD)% 為 0.52%。
Winbond Electronics 位於哪個產業?
Winbond Electronics從事於Information Technology產業。
Winbond Electronics 何時完成拆股?
Winbond Electronics 最近沒有進行任何拆股。
Winbond Electronics 的總部在哪裡?
Winbond Electronics 的總部位於 TW 的 Taichung。