JCET Group 

JCET Group Co., Ltd., originally founded in Jiangyin, China, in 1972, operates as a global provider of integrated-circuit fabrication and associated technology services. The company specializes in a variety of semiconductor packaging methodologies, including advanced wafer-level packaging, system-in-package (SiP) solutions, flip chip technology, and wire bonding. These offerings cater to a broad spectrum of demanding applications, such as mobile communications, telecommunications infrastructure, computing platforms, consumer electronics, automotive systems, and industrial sectors. Beyond manufacturing, JCET also delivers comprehensive support services, covering design and characterization, research and development (R&D), wafer probing, bumping processes, package assembly, logistics, and rigorous product testing. The firm, which was previously named Jiangsu Changjiang Electronics Technology Co., Ltd., officially rebranded to JCET Group Co., Ltd. in November 2019.