Stock Events

Stock Events

Weifu High-Technology Group (000581.SZ) July 2018 Dividend

¥18.97
-¥0.03-0.16% Wednesday 00:00
Dividend Yield
5.26%
Dividend amount
¥1
¥1.2
Per Share

Announced

Confirmed • April 17, 18

Ex Date

Reached • July 18, 18

Pay Date

Paid • July 18, 18

Description

Weifu High-Technology Group (000581.SZ) has announced a dividend of ¥1.2 with an ex date of July 18, 2018 and a payment date of July 18, 2018. The record date is July 17, 2018.

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