Shenzhen Techwinsemi Technology. (001309.SZ) July 2023 Dividend

¥251.00
+¥7.83+3.22%Friday 00:00
Dividend Yield
0.43%
Dividend amount
¥1.07
¥0.13
Per Share

Announced

Confirmed • May 3, 2023

Ex Date

Reached • July 13, 2023

Pay Date

Paid • July 13, 2023

Description

⁨Shenzhen Techwinsemi Technology.⁩ (⁦001309.SZ⁩) has announced a dividend of ⁦¥0.13⁩ with an ex date of July 13, 2023 and a payment date of July 13, 2023. The record date is July 12, 2023.

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