Stock Events

Stock Events

JPMorgan Core Plus Bond Fund Class I (HLIPX) July 2023 Dividend

$7.3
+$0.01+0.14% Friday 00:00
Dividend Yield
4.92%
Dividend amount
$0.36
$0.02
Per Share

Announced

Confirmed • July 27, 23

Ex Date

Reached • July 27, 23

Pay Date

Paid • July 28, 23

Description

JPMorgan Core Plus Bond Fund Class I (HLIPX) has announced a dividend of $0.02 with an ex date of July 27, 2023 and a payment date of July 28, 2023. The record date is July 26, 2023.

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