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Stock Events

Wafer Works (Shanghai). (688584.SHG) July 2024 Dividend

¥18.7
-¥0.18-0.95% Friday 00:00
Dividend Yield
1.07%
Dividend amount
¥0.2
¥0.3
Per Share

Announced

Confirmed • April 26, 24

Ex Date

Reached • July 22, 24

Pay Date

Paid • July 22, 24

Description

Wafer Works (Shanghai). (688584.SHG) has announced a dividend of ¥0.3 with an ex date of July 22, 2024 and a payment date of July 22, 2024. The record date is July 19, 2024.

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