Stock Events

Stock Events

Wafer Works (Shanghai). (688584.SHG) June 2025 Dividend

¥18.7
-¥0.18-0.95% Friday 00:00
Dividend Yield
1.07%
Dividend amount
¥0.2
¥0.2
Per Share

Announced

Confirmed • March 19, 25

Ex Date

Reached • June 18, 25

Pay Date

Paid • June 18, 25

Description

Wafer Works (Shanghai). (688584.SHG) has announced a dividend of ¥0.2 with an ex date of June 18, 2025 and a payment date of June 18, 2025. The record date is June 17, 2025.

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