Stock Events

Stock Events

Sia Engineering Company Limited (SEGSF) August 2017 Dividend

$2.55
+$0.4+18.6% Monday 00:00
Dividend Yield
2.87%
Dividend amount
$0.07
$0.04
Per Share

Announced

Confirmed • May 12, 17

Ex Date

Reached • July 27, 17

Pay Date

Paid • August 08, 17

Description

Sia Engineering Company Limited (SEGSF) has announced a dividend of $0.04 with an ex date of July 27, 2017 and a payment date of August 08, 2017. The record date is July 28, 2017.

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