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Stock Events

Telink Semiconductor (Shanghai). (688591.SHG) July 2024 Dividend

¥34.83
+¥0.59+1.72% Friday 00:00
Dividend Yield
0.59%
Dividend amount
¥0.21
¥0.07
Per Share

Announced

Confirmed • May 03, 24

Ex Date

Reached • July 24, 24

Pay Date

Paid • July 24, 24

Description

Telink Semiconductor (Shanghai). (688591.SHG) has announced a dividend of ¥0.07 with an ex date of July 24, 2024 and a payment date of July 24, 2024. The record date is July 23, 2024.

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