Stock Events

Stock Events

Telink Semiconductor (Shanghai). (688591.SHG) June 2026 Dividend

¥29.57
+¥0.03+0.1%Thursday 00:00
Dividend Yield
0.9%
Dividend amount
¥0.27
¥0.27
Per Share

Announced

Confirmed • April 10, 2026

Ex Date

Reached • June 17, 2026

Pay Date

Paid • June 17, 2026

Description

⁨Telink Semiconductor (Shanghai).⁩ (⁦688591.SHG⁩) has announced a dividend of ⁦¥0.27⁩ with an ex date of June 17, 2026 and a payment date of June 17, 2026. The record date is June 16, 2026.

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