Stock Events

Stock Events

Shanghai Fudan Microelectronics Group Company (1385.HK) July 2026 Dividend

HK$23.58
+HK$0.90+3.97%Friday 00:00
Dividend Yield
0.28%
Dividend amount
HK$0.07
HK$0.07
Per Share

Announced

Confirmed • March 27, 2026

Ex Date

Reached • June 25, 2026

Pay Date

Paid • July 22, 2026

Description

⁨Shanghai Fudan Microelectronics Group Company⁩ (⁦1385.HK⁩) has announced a dividend of ⁦HK$0.07⁩ with an ex date of June 25, 2026 and a payment date of July 22, 2026. The record date is June 29, 2026.

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