Shanghai Fudan Microelectronics Group Company (1385.HK) July 2027 Dividend

HK$24.84
+HK$2.88+13.11%Friday 00:00
Dividend Yield
0.27%
Dividend amount
HK$0.07
HK$0.07
Per Share

Estimated

This is an estimated dividend. The company has not yet announced the real dividend. Please be very careful when using this information.

Ex Date

in 250 days • June 25, 2027

Pay Date

in 277 days • July 22, 2027

Description

⁨Shanghai Fudan Microelectronics Group Company⁩ (⁦1385.HK⁩) has announced a dividend of ⁦HK$0.07⁩ with an ex date of June 25, 2027 and a payment date of July 22, 2027. The record date is N/A.

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