MIRAE ASSET TIGER Samsung Electronics SK Hynix US Bond Balanced 50 (0233J0.KQ). Dividend Frequency: quarterly. The latest recorded dividend from MIRAE ASSET TIGER Samsung Electronics SK Hynix US Bond Balanced 50 was ₩46 per share. Last ex-date: October 29, 2026. The last dividend payment from MIRAE ASSET TIGER Samsung Electronics SK Hynix US Bond Balanced 50 was made on November 3, 2026. The next dividend payment from MIRAE ASSET TIGER Samsung Electronics SK Hynix US Bond Balanced 50 is estimated for February 3, 2027. Estimated next dividend amount: ₩46. The current dividend yield of MIRAE ASSET TIGER Samsung Electronics SK Hynix US Bond Balanced 50 is 1.95%.

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.