Stock Events

HLB innoVation. 

₩3,175
2
-₩25-0.78% Today

Statistics

Day High
3,240
Day Low
3,010
52W High
7,110
52W Low
2,300
Volume
279,931
Avg. Volume
989,079
Mkt Cap
228.8B
P/E Ratio
-
Dividend Yield
-
Dividend
-

Earnings

28JunExpected
Q2 2017
Q3 2017
Q4 2017
Q1 2018
Q2 2018
Q3 2018
Q1 2024
-23.79
-14.95
-6.11
2.72
Expected EPS
N/A
Actual EPS
N/A

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About

HLB innoVation Co.,Ltd. engages in the manufacture and sale of electronic parts and dies in South Korea and internationally. The company offers various lead frames, such as plastic dual in-line package, plastic leaded chip carrier, small outline integrated circuit, quad flat pack, transistor outline, and other products; tooling products, including lead frame tool, mold tool, and contact mold; and pre-mold products for use in image and pressure sensors for automobiles, medical devices, and optoelectronics, as well as packaging solution. It also provides rivetted L/F for heat-producing semiconductor products; lead frame for power module; and LGA, BGA, and TSOP products for use in CPU, institution, PC, laptop, portable small laptop, smartphone, etc. The company was formerly known as PSMC CO., Ltd and changed its name to HLB innoVation Co.,Ltd. in March 2023. HLB innoVation Co.,Ltd. was founded in 1978 and is headquartered in Hwaseong-si, South Korea.
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CEO
Mr. Dong Soo Jung
Country
KR
ISIN
KR7024850000

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