Stock Events

Duksan Hi-Metal 

₩6,400
1
+₩0+0% Friday 06:30

Statistics

Day High
6,440
Day Low
6,310
52W High
9,240
52W Low
5,930
Volume
121,329
Avg. Volume
611,170
Mkt Cap
300.78B
P/E Ratio
-
Dividend Yield
-
Dividend
-

Dividends

0%Dividend Yield
10Y Growth
N/A
5Y Growth
N/A
3Y Growth
N/A
1Y Growth
N/A

Earnings

14MayConfirmed
Q3 2022
Q4 2022
Q1 2023
Q2 2023
Q3 2023
Q4 2023
Q1 2024
22.9
23.24
23.57
23.9
Expected EPS
N/A
Actual EPS
N/A

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Competitors

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About

Duksan Hi Metal Co.,Ltd manufactures and sells soldering materials for use in semiconductor packaging primarily in South Korea. The company offers solder ball, a semiconductor packaging technology that transmits electric signals by connecting chips and boards; solder paste, a substance for surface mounting technology and formation of flip chip bump, which solders technology as electronic component keep being developed; and solder powder, a substance of solder paste that is used for soldering PCBs and devices. The company also provides anisotropic conductive film (ACF) for directional electrical contact and chemical bonding, such as display, drive IC, PCB, etc.; conductive particle, a component of ACF that anisotropically controls electrical current; cored solder ball, which forms bumps between a substrate and a chip; low alpha tin for solving the problem of soft errors occurred in chips; silver nanowires; thermally conductive pastes; and EMI shielding pastes. The company was founded in 1999 and is headquartered in Ulsan, South Korea. Duksan Hi Metal Co.,Ltd is a subsidiary of DUKSAN group.
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CEO
Mr. Jun-Ho Lee
Employees
199
Country
KR
ISIN
KR7077360006

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