Hong Leong Bond Fund - Standalone Investment Plan (0P00008MDF.FUND) Dividend 2026: History, Ex-Dividend Dates & Yield

RM0.5584
+RM0.00+0.02%Friday 00:00
Dividend Yield
0.54%
Dividend amount
RM0.00
Last ex-date
Jul 20, 2026
Last pay date
Jul 20, 2026

Summary

Hong Leong Bond Fund - Standalone Investment Plan (0P00008MDF.FUND). Dividend Frequency: annual. The latest recorded dividend from Hong Leong Bond Fund - Standalone Investment Plan was RM0.00 per share. Last ex-date: July 20, 2026. The last dividend payment from Hong Leong Bond Fund - Standalone Investment Plan was made on July 20, 2026. The next dividend payment from Hong Leong Bond Fund - Standalone Investment Plan is estimated for July 19, 2027. Estimated next dividend amount: RM0.00. The current dividend yield of Hong Leong Bond Fund - Standalone Investment Plan is 0.54%.

Upcoming

Past

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.

DateAmountChange
· YTDRM0.00
-
Jul 20, 2026
RM0.00
-
RM0.00
-50%
Jan 15, 2025
RM0.00
-
RM0.01
+36.36%
Jul 18, 2024
RM0.00
-
Jan 22, 2024
RM0.00
+20%
RM0.00
-15.38%
Jul 17, 2023
RM0.00
+31.58%
Jan 13, 2023
RM0.00
-5%
RM0.01
-42.22%
Jul 18, 2022
RM0.00
-37.5%
Jan 20, 2022
RM0.00
-64.44%
RM0.01
-
Jul 23, 2021
RM0.01
-
RM0.01
-
Jul 21, 2020
RM0.01
-
10Y Growth
0%
5Y Growth
0%
3Y Growth
0%
1Y Growth
0%

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FAQs

How much dividend does Hong Leong Bond Fund - Standalone Investment Plan pay?▼
Based on the current price and yield, the annualized dividend estimate for Hong Leong Bond Fund - Standalone Investment Plan is RM0.00 per share.
What is the dividend yield of Hong Leong Bond Fund - Standalone Investment Plan?▼
The current dividend yield of Hong Leong Bond Fund - Standalone Investment Plan is 0.54%.
When does Hong Leong Bond Fund - Standalone Investment Plan pay dividends?▼
Dividend Frequency: annual. The next dividend payment from Hong Leong Bond Fund - Standalone Investment Plan is estimated for July 19, 2027.
When is the next dividend from Hong Leong Bond Fund - Standalone Investment Plan?▼
The next dividend payment from Hong Leong Bond Fund - Standalone Investment Plan is estimated for July 19, 2027.
How safe is the dividend of Hong Leong Bond Fund - Standalone Investment Plan?▼
Hong Leong Bond Fund - Standalone Investment Plan has paid a dividend for 5 consecutive years.
What is the dividend of Hong Leong Bond Fund - Standalone Investment Plan?▼
The latest recorded dividend from Hong Leong Bond Fund - Standalone Investment Plan was RM0.00 per share.
When did I have to buy the shares of Hong Leong Bond Fund - Standalone Investment Plan to receive the previous dividend?▼
To receive the previous dividend from Hong Leong Bond Fund - Standalone Investment Plan, you needed to own the shares before the ex-dividend date of July 20, 2026.
When did Hong Leong Bond Fund - Standalone Investment Plan pay the last dividend?▼
The last dividend payment from Hong Leong Bond Fund - Standalone Investment Plan was made on July 20, 2026.
What was the dividend of Hong Leong Bond Fund - Standalone Investment Plan in 2025?▼
Hong Leong Bond Fund - Standalone Investment Plan has recorded dividends totaling RM0.00 per share for 2025.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in MYR.