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Hanwha PLUS Japan Semiconductor Materials and Equipment (464920.KQ) Dividend 2026: History, Ex-Dividend Dates & Yield

₩21,515
-₩480-2.18%Wednesday 00:00
Dividend Yield
0.98%
Dividend amount
₩215
Last ex-date
Apr 29, 2026
Last pay date
May 6, 2026

Summary

Hanwha PLUS Japan Semiconductor Materials and Equipment (464920.KQ). Dividend Frequency: quarterly. The latest recorded dividend from Hanwha PLUS Japan Semiconductor Materials and Equipment was ₩215 per share. Last ex-date: April 29, 2026. The last dividend payment from Hanwha PLUS Japan Semiconductor Materials and Equipment was made on May 6, 2026. The next dividend payment from Hanwha PLUS Japan Semiconductor Materials and Equipment is estimated for May 6, 2027. Estimated next dividend amount: ₩215. The current dividend yield of Hanwha PLUS Japan Semiconductor Materials and Equipment is 0.98%.

Upcoming

Apr 29, 2027
Dividend Ex
Estimated
 
May 6, 2027
Dividend Payment
Estimated
 
May 1, 2028
Dividend Ex
Estimated
 
May 5, 2028
Dividend Payment
Estimated
 

Past

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.

DateAmountChange
· YTD₩215
-
May 6, 2026
₩215
+72%
₩125
-
May 7, 2025
₩125
-
10Y Growth
0%
5Y Growth
0%
3Y Growth
0%
1Y Growth
72%

Community

FAQs

How much dividend does Hanwha PLUS Japan Semiconductor Materials and Equipment pay?▼
Based on the current price and yield, the annualized dividend estimate for Hanwha PLUS Japan Semiconductor Materials and Equipment is ₩210 per share.
What is the dividend yield of Hanwha PLUS Japan Semiconductor Materials and Equipment?▼
The current dividend yield of Hanwha PLUS Japan Semiconductor Materials and Equipment is 0.98%.
When does Hanwha PLUS Japan Semiconductor Materials and Equipment pay dividends?▼
Dividend Frequency: quarterly. The next dividend payment from Hanwha PLUS Japan Semiconductor Materials and Equipment is estimated for May 6, 2027.
When is the next dividend from Hanwha PLUS Japan Semiconductor Materials and Equipment?▼
The next dividend payment from Hanwha PLUS Japan Semiconductor Materials and Equipment is estimated for May 6, 2027.
What is the dividend of Hanwha PLUS Japan Semiconductor Materials and Equipment?▼
The latest recorded dividend from Hanwha PLUS Japan Semiconductor Materials and Equipment was ₩215 per share.
When did I have to buy the shares of Hanwha PLUS Japan Semiconductor Materials and Equipment to receive the previous dividend?▼
To receive the previous dividend from Hanwha PLUS Japan Semiconductor Materials and Equipment, you needed to own the shares before the ex-dividend date of April 29, 2026.
When did Hanwha PLUS Japan Semiconductor Materials and Equipment pay the last dividend?▼
The last dividend payment from Hanwha PLUS Japan Semiconductor Materials and Equipment was made on May 6, 2026.
What was the dividend of Hanwha PLUS Japan Semiconductor Materials and Equipment in 2025?▼
Hanwha PLUS Japan Semiconductor Materials and Equipment has recorded dividends totaling ₩125 per share for 2025.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in KRW.