SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) Dividend 2026: History, Ex-Dividend Dates & Yield

₩8,025
+₩10+0.12%Monday 00:00
Dividend Yield
5.35%
Dividend amount
₩35
Last ex-date
Sep 29, 2026
Last pay date
Oct 2, 2026

Summary

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ). Dividend Frequency: monthly. The latest recorded dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was ₩35 per share. Last ex-date: September 29, 2026. The last dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was made on October 2, 2026. The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for November 4, 2026. Estimated next dividend amount: ₩36. The current dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is 5.35%.

Upcoming

Past

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.

DateAmountChange
· YTD₩356
-
Oct 2, 2026
₩35
-
Sep 2, 2026
₩35
-
Aug 4, 2026
₩35
-5.41%
Jul 2, 2026
₩37
+2.78%
Jun 2, 2026
₩36
-2.7%
May 6, 2026
₩37
+15.63%
Apr 2, 2026
₩32
-11.11%
Mar 4, 2026
₩36
-2.7%
Feb 3, 2026
₩37
+2.78%
Jan 5, 2026
₩36
-2.7%
₩450
+125%
Dec 2, 2025
₩37
+2.78%
Nov 4, 2025
₩36
+2.86%
Oct 2, 2025
₩35
-5.41%
Sep 2, 2025
₩37
+5.71%
Aug 4, 2025
₩35
-2.78%
Jul 2, 2025
₩36
-2.7%
Jun 4, 2025
₩37
-
May 7, 2025
₩37
-5.13%
Apr 2, 2025
₩39
+2.63%
Mar 5, 2025
₩38
-
10Y Growth
0%
5Y Growth
0%
3Y Growth
0%
1Y Growth
-3.6%

Community

FAQs

How much dividend does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay?▼
Based on the current price and yield, the annualized dividend estimate for SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is ₩430 per share.
What is the dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The current dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is 5.35%.
When does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay dividends?▼
Dividend Frequency: monthly. The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for November 4, 2026.
When is the next dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for November 4, 2026.
How safe is the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) has raised its dividend for 1 consecutive years.
What is the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The latest recorded dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was ₩35 per share.
When did I have to buy the shares of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) to receive the previous dividend?▼
To receive the previous dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H), you needed to own the shares before the ex-dividend date of September 29, 2026.
When did SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay the last dividend?▼
The last dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was made on October 2, 2026.
What was the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) in 2025?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) has recorded dividends totaling ₩450 per share for 2025.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in KRW.