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SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) Dividend 2026: History, Ex-Dividend Dates & Yield

₩8,245
+₩30+0.37% Friday 00:00
Dividend Yield
5.2%
Dividend amount
₩35
Last ex-date
Sep 29, 2026
Last pay date
Oct 02, 2026

Summary

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) dividends are paid monthly. The latest dividend per share was ₩35 with an ex date of September 29, 2026 and a payment date of October 02, 2026. The next dividend per share will be ₩35 with an ex date of September 29, 2026 and a payment date of October 02, 2026. The current dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) is 5.2%.

Upcoming

29
SEP
Dividend Ex
Estimated
 
2
OCT
Dividend Payment
Estimated
 
30
OCT
Dividend Ex
Estimated
 
4
NOV
Dividend Payment
Estimated
 
27
NOV
Dividend Ex
Estimated
 
2
DEC
Dividend Payment
Estimated
 

Past

DateAmountChange
₩429
-4.67%
02 Oct 2026
₩35
-
02 Sep 2026
₩35
-
04 Aug 2026
₩35
-5.41%
02 Jul 2026
₩37
+2.78%
02 Jun 2026
₩36
-2.7%
06 May 2026
₩37
+15.63%
02 Apr 2026
₩32
-11.11%
04 Mar 2026
₩36
-2.7%
03 Feb 2026
₩37
+2.78%
05 Jan 2026
₩36
-2.7%
₩450
+125%
02 Dec 2025
₩37
+2.78%
04 Nov 2025
₩36
+2.86%
02 Oct 2025
₩35
-5.41%
02 Sep 2025
₩37
+5.71%
04 Aug 2025
₩35
-2.78%
02 Jul 2025
₩36
-2.7%
04 Jun 2025
₩37
-
07 May 2025
₩37
-5.13%
02 Apr 2025
₩39
+2.63%
05 Mar 2025
₩38
-
10Y Growth
N/A
5Y Growth
N/A
3Y Growth
N/A
1Y Growth
-4.03%

Community

FAQ

How much dividend does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pays an annual dividend of ₩429 per share, with a dividend yield of 5.2%.
What is the dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The current dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is 5.2%.
When does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay dividends?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pays dividends monthly. The next payment is expected on October 02, 2026.
When is the next dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for October 02, 2026.
How safe is the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) has raised its dividend for 1 consecutive years, with a payout ratio of 0%.
What is the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) currently pays a dividend of ₩35 per share.
When did I have to buy the shares of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) to receive the previous dividend?▼
To receive the previous dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H), you needed to own the shares before the ex-dividend date of August 28, 2026.
When did SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay the last dividend?▼
The last dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was made on September 02, 2026.
What was the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) in 2025?▼
In 2025, SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) paid a total dividend of ₩450 per share.
In which currency does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) distribute the dividend?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) distributes its dividends in KRW.