SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ). Dividend Frequency: monthly. The latest recorded dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was ₩35 per share. Last ex-date: September 29, 2026. The last dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was made on October 2, 2026. The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for November 4, 2026. Estimated next dividend amount: ₩36. The current dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is 5.35%.
Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.
FAQs
How much dividend does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay?▼
Based on the current price and yield, the annualized dividend estimate for SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is ₩430 per share.
What is the dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The current dividend yield of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is 5.35%.
When does SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay dividends?▼
Dividend Frequency: monthly. The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for November 4, 2026.
When is the next dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The next dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) is estimated for November 4, 2026.
How safe is the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) has raised its dividend for 1 consecutive years.
What is the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)?▼
The latest recorded dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was ₩35 per share.
When did I have to buy the shares of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) to receive the previous dividend?▼
To receive the previous dividend from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H), you needed to own the shares before the ex-dividend date of September 29, 2026.
When did SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) pay the last dividend?▼
The last dividend payment from SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) was made on October 2, 2026.
What was the dividend of SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) in 2025?▼
SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) has recorded dividends totaling ₩450 per share for 2025.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in KRW.