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DAISHIN DAISHIN AI Semiconductor & Infrastructure Active (486240.KQ) Dividend 2026: History, Ex-Dividend Dates & Yield

₩24,355
+₩585+2.46%Wednesday 00:00
Dividend Yield
0.34%
Dividend amount
₩82
Last ex-date
Apr 29, 2026
Last pay date
May 6, 2026

Summary

DAISHIN DAISHIN AI Semiconductor & Infrastructure Active (486240.KQ). Dividend Frequency: quarterly. The latest recorded dividend from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active was ₩82 per share. Last ex-date: April 29, 2026. The last dividend payment from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active was made on May 6, 2026. The next dividend payment from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active is estimated for May 6, 2027. Estimated next dividend amount: ₩82. The current dividend yield of DAISHIN DAISHIN AI Semiconductor & Infrastructure Active is 0.34%.

Upcoming

Apr 29, 2027
Dividend Ex
Estimated
 
May 6, 2027
Dividend Payment
Estimated
 
May 1, 2028
Dividend Ex
Estimated
 
May 5, 2028
Dividend Payment
Estimated
 

Past

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.

DateAmountChange
· YTD₩82
-
May 6, 2026
₩82
+30.16%
₩63
-
May 7, 2025
₩63
-
10Y Growth
0%
5Y Growth
0%
3Y Growth
0%
1Y Growth
30.16%

Community

FAQs

How much dividend does DAISHIN DAISHIN AI Semiconductor & Infrastructure Active pay?▼
Based on the current price and yield, the annualized dividend estimate for DAISHIN DAISHIN AI Semiconductor & Infrastructure Active is ₩84 per share.
What is the dividend yield of DAISHIN DAISHIN AI Semiconductor & Infrastructure Active?▼
The current dividend yield of DAISHIN DAISHIN AI Semiconductor & Infrastructure Active is 0.34%.
When does DAISHIN DAISHIN AI Semiconductor & Infrastructure Active pay dividends?▼
Dividend Frequency: quarterly. The next dividend payment from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active is estimated for May 6, 2027.
When is the next dividend from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active?▼
The next dividend payment from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active is estimated for May 6, 2027.
What is the dividend of DAISHIN DAISHIN AI Semiconductor & Infrastructure Active?▼
The latest recorded dividend from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active was ₩82 per share.
When did I have to buy the shares of DAISHIN DAISHIN AI Semiconductor & Infrastructure Active to receive the previous dividend?▼
To receive the previous dividend from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active, you needed to own the shares before the ex-dividend date of April 29, 2026.
When did DAISHIN DAISHIN AI Semiconductor & Infrastructure Active pay the last dividend?▼
The last dividend payment from DAISHIN DAISHIN AI Semiconductor & Infrastructure Active was made on May 6, 2026.
What was the dividend of DAISHIN DAISHIN AI Semiconductor & Infrastructure Active in 2025?▼
DAISHIN DAISHIN AI Semiconductor & Infrastructure Active has recorded dividends totaling ₩63 per share for 2025.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in KRW.