JP Morgan Hang Seng Hong Kong Stock Connect 50 (520950.SHG). Dividend Frequency: quarterly. The latest recorded dividend from JP Morgan Hang Seng Hong Kong Stock Connect 50 was ¥0.00 per share. Last ex-date: October 21, 2026. The last dividend payment from JP Morgan Hang Seng Hong Kong Stock Connect 50 was made on October 28, 2026. The next dividend payment from JP Morgan Hang Seng Hong Kong Stock Connect 50 is estimated for January 28, 2027. Estimated next dividend amount: ¥0.00. The current dividend yield of JP Morgan Hang Seng Hong Kong Stock Connect 50 is 2.2%.

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.