Hirakawa Hewtech (5821.TSE) dividends are paid semi-annual. The latest dividend per share was ¥24 with an ex date of March 30, 2026 and a payment date of June 08, 2026. The next dividend per share will be ¥25 with an ex date of September 29, 2026 and a payment date of December 09, 2026. The current dividend yield of Hirakawa Hewtech (5821.TSE) is 0.82%.
FAQ
How much dividend does Hirakawa Hewtech pay?▼
Hirakawa Hewtech pays an annual dividend of ¥25 per share, with a dividend yield of 0.82%.
What is the dividend yield of Hirakawa Hewtech?▼
The current dividend yield of Hirakawa Hewtech is 0.82%.
When does Hirakawa Hewtech pay dividends?▼
Hirakawa Hewtech pays dividends semi-annual. The next payment is expected on December 09, 2026.
When is the next dividend from Hirakawa Hewtech?▼
The next dividend payment from Hirakawa Hewtech is scheduled for December 09, 2026.
How safe is the dividend of Hirakawa Hewtech?▼
Hirakawa Hewtech has raised its dividend for 5 consecutive years, with a payout ratio of 22.13% and 5-year dividend growth of 13.46%.
What is the dividend of Hirakawa Hewtech?▼
Hirakawa Hewtech currently pays a dividend of ¥24 per share.
When did I have to buy the shares of Hirakawa Hewtech to receive the previous dividend?▼
To receive the previous dividend from Hirakawa Hewtech, you needed to own the shares before the ex-dividend date of March 30, 2026.
When did Hirakawa Hewtech pay the last dividend?▼
The last dividend payment from Hirakawa Hewtech was made on June 08, 2026.
What was the dividend of Hirakawa Hewtech in 2025?▼
In 2025, Hirakawa Hewtech paid a total dividend of ¥46 per share.
In which currency does Hirakawa Hewtech distribute the dividend?▼
Hirakawa Hewtech distributes its dividends in JPY.