China Wafer Level CSP (603005.SHG) Dividend 2026: History, Ex-Dividend Dates & Yield

¥33.51
+¥0.41+1.24% Friday 00:00
Dividend Yield
0.36%
Dividend amount
¥0.12
Last ex-date
May 18, 2026
Last pay date
May 18, 2026

Summary

China Wafer Level CSP (603005.SHG) dividends are paid annual. The latest dividend per share was ¥0.12 with an ex date of May 18, 2026 and a payment date of May 18, 2026. The next dividend per share will be ¥0.12 with an ex date of May 18, 2027 and a payment date of May 18, 2027. The current dividend yield of China Wafer Level CSP (603005.SHG) is 0.36%.

Upcoming

Past

DateAmountChange
¥0.12
+42.86%
18 May 2026
¥0.12
+42.86%
¥0.08
+82.61%
04 Jul 2025
¥0.08
+82.61%
¥0.05
-34.29%
24 May 2024
¥0.05
-34.29%
¥0.07
-67.84%
10 Jul 2023
¥0.07
-67.84%
¥0.22
+20.43%
20 May 2022
¥0.22
+20.43%
¥0.18
+135%
15 Jun 2021
¥0.18
+135%
¥0.08
+42.86%
19 May 2020
¥0.08
+42.86%
¥0.05
-17.65%
15 Apr 2019
¥0.05
-17.65%
¥0.07
+66.67%
21 Jun 2018
¥0.07
+66.67%
¥0.04
-53.64%
12 May 2017
¥0.04
-53.64%
¥0.08
-38.89%
19 May 2016
¥0.08
-38.89%
¥0.14
+20%
22 May 2015
¥0.14
+20%
¥0.12
-
21 May 2014
¥0.12
-
10Y Growth
3.56%
5Y Growth
N/A
3Y Growth
19.68%
1Y Growth
42.86%

Community

FAQ

How much dividend does China Wafer Level CSP pay?
China Wafer Level CSP pays an annual dividend of ¥0.12 per share, with a dividend yield of 0.36%.
What is the dividend yield of China Wafer Level CSP?
The current dividend yield of China Wafer Level CSP is 0.36%.
When does China Wafer Level CSP pay dividends?
China Wafer Level CSP pays dividends annual. The next payment is expected on May 18, 2027.
When is the next dividend from China Wafer Level CSP?
The next dividend payment from China Wafer Level CSP is estimated for May 18, 2027.
How safe is the dividend of China Wafer Level CSP?
China Wafer Level CSP has raised its dividend for 1 consecutive years, with a payout ratio of 17.1%.
What is the dividend of China Wafer Level CSP?
China Wafer Level CSP currently pays a dividend of ¥0.12 per share.
When did I have to buy the shares of China Wafer Level CSP to receive the previous dividend?
To receive the previous dividend from China Wafer Level CSP, you needed to own the shares before the ex-dividend date of May 18, 2026.
When did China Wafer Level CSP pay the last dividend?
The last dividend payment from China Wafer Level CSP was made on May 18, 2026.
What was the dividend of China Wafer Level CSP in 2025?
In 2025, China Wafer Level CSP paid a total dividend of ¥0.08 per share.
In which currency does China Wafer Level CSP distribute the dividend?
China Wafer Level CSP distributes its dividends in CNY.