China Wafer Level CSP (603005.SHG) dividends are paid annual. The latest dividend per share was ¥0.12 with an ex date of May 18, 2026 and a payment date of May 18, 2026. The next dividend per share will be ¥0.12 with an ex date of May 18, 2027 and a payment date of May 18, 2027. The current dividend yield of China Wafer Level CSP (603005.SHG) is 0.36%.
FAQ
How much dividend does China Wafer Level CSP pay?▼
China Wafer Level CSP pays an annual dividend of ¥0.12 per share, with a dividend yield of 0.36%.
What is the dividend yield of China Wafer Level CSP?▼
The current dividend yield of China Wafer Level CSP is 0.36%.
When does China Wafer Level CSP pay dividends?▼
China Wafer Level CSP pays dividends annual. The next payment is expected on May 18, 2027.
When is the next dividend from China Wafer Level CSP?▼
The next dividend payment from China Wafer Level CSP is estimated for May 18, 2027.
How safe is the dividend of China Wafer Level CSP?▼
China Wafer Level CSP has raised its dividend for 1 consecutive years, with a payout ratio of 17.1%.
What is the dividend of China Wafer Level CSP?▼
China Wafer Level CSP currently pays a dividend of ¥0.12 per share.
When did I have to buy the shares of China Wafer Level CSP to receive the previous dividend?▼
To receive the previous dividend from China Wafer Level CSP, you needed to own the shares before the ex-dividend date of May 18, 2026.
When did China Wafer Level CSP pay the last dividend?▼
The last dividend payment from China Wafer Level CSP was made on May 18, 2026.
What was the dividend of China Wafer Level CSP in 2025?▼
In 2025, China Wafer Level CSP paid a total dividend of ¥0.08 per share.
In which currency does China Wafer Level CSP distribute the dividend?▼
China Wafer Level CSP distributes its dividends in CNY.