China Wafer Level CSP (603005.SHG) dividends are paid annual. The latest dividend per share was ¥0.08 with an ex date of July 04, 2025 and a payment date of July 04, 2025. The next dividend per share will be ¥0.08 with an ex date of July 06, 2026 and a payment date of July 06, 2026. The curreny dividend yield of China Wafer Level CSP (603005.SHG) is 0.26%.
FAQ
How much dividend does China Wafer Level CSP pay?▼
China Wafer Level CSP pays an annual dividend of ¥0.08 per share, with a dividend yield of 0.26%.
What is the dividend yield of China Wafer Level CSP?▼
The current dividend yield of China Wafer Level CSP is 0.26%.
When does China Wafer Level CSP pay dividends?▼
China Wafer Level CSP pays dividends annual. The next payment is expected on July 06, 2026.
When is the next dividend from China Wafer Level CSP?▼
The next dividend payment from China Wafer Level CSP is estimated for July 06, 2026.
How safe is the dividend of China Wafer Level CSP?▼
China Wafer Level CSP paid dividend every year within the last 11 years.
What is the dividend of China Wafer Level CSP?▼
China Wafer Level CSP currently pays a dividend of ¥0.08 per share.
When did I have to buy the shares of China Wafer Level CSP to receive the previous dividend?▼
To receive the previous dividend from China Wafer Level CSP, you needed to own the shares before the ex-dividend date of July 04, 2025.
When did China Wafer Level CSP pay the last dividend?▼
The last dividend payment from China Wafer Level CSP was made on July 04, 2025.
What was the dividend of China Wafer Level CSP in 2025?▼
In 2025, China Wafer Level CSP paid a total dividend of ¥0.08 per share.
In which currency does China Wafer Level CSP distribute the dividend?▼
China Wafer Level CSP distributes its dividends in CNY.
Where can I find more information on dividend safety?▼
faqSafetyInfoAnswer