Chipbond Technology (6147.TWO) dividends are paid annual. The latest dividend per share was TWD2.80 with an ex date of June 17, 2026 and a payment date of July 15, 2026. The next dividend per share will be TWD2.80 with an ex date of June 17, 2027 and a payment date of July 15, 2027. The current dividend yield of Chipbond Technology (6147.TWO) is 1.53%.
FAQ
How much dividend does Chipbond Technology pay?▼
Chipbond Technology pays an annual dividend of TWD2.90 per share, with a dividend yield of 1.53%.
What is the dividend yield of Chipbond Technology?▼
The current dividend yield of Chipbond Technology is 1.53%.
When does Chipbond Technology pay dividends?▼
Chipbond Technology pays dividends annual. The next payment is expected on July 15, 2027.
When is the next dividend from Chipbond Technology?▼
The next dividend payment from Chipbond Technology is estimated for July 15, 2027.
How safe is the dividend of Chipbond Technology?▼
Chipbond Technology has raised its dividend for 4 consecutive years, with a payout ratio of 95.83% and 5-year dividend growth of 62.12%.
What is the dividend of Chipbond Technology?▼
Chipbond Technology currently pays a dividend of TWD2.80 per share.
When did I have to buy the shares of Chipbond Technology to receive the previous dividend?▼
To receive the previous dividend from Chipbond Technology, you needed to own the shares before the ex-dividend date of June 17, 2026.
When did Chipbond Technology pay the last dividend?▼
The last dividend payment from Chipbond Technology was made on July 15, 2026.
What was the dividend of Chipbond Technology in 2025?▼
In 2025, Chipbond Technology paid a total dividend of TWD3.75 per share.
In which currency does Chipbond Technology distribute the dividend?▼
Chipbond Technology distributes its dividends in TWD.