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Chipbond Technology (6147.TWO) Dividend 2026: History, Ex-Dividend Dates & Yield

TWD207.50
-TWD7.00-3.26%Friday 00:00
Dividend Yield
1.35%
Dividend amount
TWD2.80
Last ex-date
Jun 17, 2026
Last pay date
Jul 15, 2026

Summary

Chipbond Technology (6147.TWO). Dividend Frequency: annual. The latest recorded dividend from Chipbond Technology was TWD2.80 per share. Last ex-date: June 17, 2026. The last dividend payment from Chipbond Technology was made on July 15, 2026. The next dividend payment from Chipbond Technology is estimated for July 15, 2027. Estimated next dividend amount: TWD2.80. The current dividend yield of Chipbond Technology is 1.35%.

Upcoming

Jun 17, 2027
Dividend Ex
Estimated
 
Jul 15, 2027
Dividend Payment
Estimated
 
Jun 19, 2028
Dividend Ex
Estimated
 
Jul 17, 2028
Dividend Payment
Estimated
 

Past

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.

DateAmountChange
· YTDTWD2.80
-
Jul 15, 2026
TWD2.80
-25.34%
TWD3.75
+0.01%
Jul 15, 2025
TWD3.75
+0.01%
TWD3.75
-31.82%
Jun 14, 2024
TWD3.75
+7.14%
TWD5.50
-8.33%
Jul 14, 2023
TWD3.50
+75%
Jul 14, 2023
TWD2.00
-63.64%
TWD6.00
+57.89%
Aug 12, 2022
TWD0.50
-85.92%
Aug 12, 2022
TWD5.50
+1,000%
TWD3.80
-9.52%
Aug 13, 2021
TWD3.55
+1,320%
Aug 13, 2021
TWD0.25
-88.64%
TWD4.20
+20%
Aug 14, 2020
TWD2.00
-42.86%
Aug 14, 2020
TWD2.20
+10%
TWD3.50
+48.94%
Aug 19, 2019
TWD3.50
+48.94%
TWD2.35
+11.9%
Aug 17, 2018
TWD2.35
+11.9%
TWD2.10
-
Aug 18, 2017
TWD2.10
-
TWD2.10
-19.23%
Aug 19, 2016
TWD2.10
+31.25%
TWD2.60
-
Aug 20, 2015
TWD1.60
+60%
Aug 20, 2015
TWD1.00
-37.5%
TWD2.60
+0.01%
Aug 20, 2014
TWD1.00
-37.49%
Aug 20, 2014
TWD1.60
+60%
TWD2.60
+30.01%
Aug 26, 2013
TWD1.00
-50%
10Y Growth
2.92%
5Y Growth
62.12%
3Y Growth
11.87%
1Y Growth
-25.34%

Community

FAQs

How much dividend does Chipbond Technology pay?▼
Based on the current price and yield, the annualized dividend estimate for Chipbond Technology is TWD2.80 per share.
What is the dividend yield of Chipbond Technology?▼
The current dividend yield of Chipbond Technology is 1.35%.
When does Chipbond Technology pay dividends?▼
Dividend Frequency: annual. The next dividend payment from Chipbond Technology is estimated for July 15, 2027.
When is the next dividend from Chipbond Technology?▼
The next dividend payment from Chipbond Technology is estimated for July 15, 2027.
How safe is the dividend of Chipbond Technology?▼
Chipbond Technology has raised its dividend for 1 consecutive years, with a payout ratio of 72.51% and 5-year dividend growth of 62.12%.
What is the dividend of Chipbond Technology?▼
The latest recorded dividend from Chipbond Technology was TWD2.80 per share.
When did I have to buy the shares of Chipbond Technology to receive the previous dividend?▼
To receive the previous dividend from Chipbond Technology, you needed to own the shares before the ex-dividend date of June 17, 2026.
When did Chipbond Technology pay the last dividend?▼
The last dividend payment from Chipbond Technology was made on July 15, 2026.
What was the dividend of Chipbond Technology in 2025?▼
Chipbond Technology has recorded dividends totaling TWD3.75 per share for 2025.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in TWD.