Dufu Technology Corp Berhad (7233.KL) dividends are paid semi-annual. The latest dividend per share was RM0.02 with an ex date of August 27, 2026 and a payment date of September 18, 2026. The next dividend per share will be RM0.02 with an ex date of May 28, 2027 and a payment date of June 15, 2027. The current dividend yield of Dufu Technology Corp Berhad (7233.KL) is 1.18%.
FAQs
How much dividend does Dufu Technology Corp Berhad pay?▼
Dufu Technology Corp Berhad pays an annual dividend of RM0.04 per share, with a dividend yield of 1.18%.
What is the dividend yield of Dufu Technology Corp Berhad?▼
The current dividend yield of Dufu Technology Corp Berhad is 1.18%.
When does Dufu Technology Corp Berhad pay dividends?▼
Dufu Technology Corp Berhad pays dividends semi-annual. The next payment is expected on June 15, 2027.
When is the next dividend from Dufu Technology Corp Berhad?▼
The next dividend payment from Dufu Technology Corp Berhad is estimated for June 15, 2027.
How safe is the dividend of Dufu Technology Corp Berhad?▼
Dufu Technology Corp Berhad has raised its dividend for 1 consecutive years, with a payout ratio of 47.95% and 5-year dividend growth of 7%.
What is the dividend of Dufu Technology Corp Berhad?▼
Dufu Technology Corp Berhad currently pays a dividend of RM0.02 per share.
When did I have to buy the shares of Dufu Technology Corp Berhad to receive the previous dividend?▼
To receive the previous dividend from Dufu Technology Corp Berhad, you needed to own the shares before the ex-dividend date of August 27, 2026.
When did Dufu Technology Corp Berhad pay the last dividend?▼
The last dividend payment from Dufu Technology Corp Berhad was made on September 18, 2026.
What was the dividend of Dufu Technology Corp Berhad in 2025?▼
In 2025, Dufu Technology Corp Berhad paid a total dividend of RM0.04 per share.
In which currency does Dufu Technology Corp Berhad distribute the dividend?▼
Dufu Technology Corp Berhad distributes its dividends in MYR.