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SEI High Yield Bond & Alternative Credit (LEND) Dividend 2026: History, Ex-Dividend Dates & Yield

$24.17
-$0.03-0.11%Friday 00:00
Dividend Yield
2.65%
Dividend amount
$0.13
Last ex-date
Oct 5, 2026
Last pay date
Oct 6, 2026

Summary

SEI High Yield Bond & Alternative Credit (LEND). Dividend Frequency: monthly. The latest recorded dividend from SEI High Yield Bond & Alternative Credit was $0.13 per share. Last ex-date: October 5, 2026. The last dividend payment from SEI High Yield Bond & Alternative Credit was made on October 6, 2026. The next dividend payment from SEI High Yield Bond & Alternative Credit is estimated for July 7, 2027. Estimated next dividend amount: $0.25. The current dividend yield of SEI High Yield Bond & Alternative Credit is 2.65%.

Upcoming

Jul 6, 2027
Dividend Ex
Estimated
 
Jul 7, 2027
Dividend Payment
Estimated
 
Aug 5, 2027
Dividend Ex
Estimated
 
Aug 6, 2027
Dividend Payment
Estimated
 
Sep 3, 2027
Dividend Ex
Estimated
 
Sep 3, 2027
Dividend Payment
Estimated
 

Past

Historical totals include confirmed records only, using payment dates where available and ex-dates otherwise. Rows marked as ex-dates do not confirm payment.

DateAmountChange
· YTD$0.64
-
Oct 6, 2026
$0.13
+11.3%
Sep 4, 2026
$0.12
-14.56%
Aug 6, 2026
$0.14
-42.37%
Jul 7, 2026
$0.25
-75.02%
$0.98
-
Jan 2, 2020
$0.98
-
10Y Growth
0%
5Y Growth
0%
3Y Growth
0%
1Y Growth
0%

Community

FAQs

How much dividend does SEI High Yield Bond & Alternative Credit pay?▼
Based on the current price and yield, the annualized dividend estimate for SEI High Yield Bond & Alternative Credit is $0.64 per share.
What is the dividend yield of SEI High Yield Bond & Alternative Credit?▼
The current dividend yield of SEI High Yield Bond & Alternative Credit is 2.65%.
When does SEI High Yield Bond & Alternative Credit pay dividends?▼
Dividend Frequency: monthly. The next dividend payment from SEI High Yield Bond & Alternative Credit is estimated for July 7, 2027.
When is the next dividend from SEI High Yield Bond & Alternative Credit?▼
The next dividend payment from SEI High Yield Bond & Alternative Credit is estimated for July 7, 2027.
What is the dividend of SEI High Yield Bond & Alternative Credit?▼
The latest recorded dividend from SEI High Yield Bond & Alternative Credit was $0.13 per share.
When did I have to buy the shares of SEI High Yield Bond & Alternative Credit to receive the previous dividend?▼
To receive the previous dividend from SEI High Yield Bond & Alternative Credit, you needed to own the shares before the ex-dividend date of October 5, 2026.
When did SEI High Yield Bond & Alternative Credit pay the last dividend?▼
The last dividend payment from SEI High Yield Bond & Alternative Credit was made on October 6, 2026.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in USD.