MI Technovation Berhad 

Mi Technovation Berhad, an investment holding company established in Malaysia in 2007, operates primarily within the semiconductor industry. The company specializes in the design, development, and manufacturing of advanced wafer level chip scale packaging (WLCSP) sorting machines, serving clients across Southeast Asia, Northeast Asia, and the North Atlantic regions. Its operations are structured into three main segments: Semiconductor Equipment Business Unit, Semiconductor Material Business Unit, and Others. Mi Technovation's equipment portfolio includes the Mi and Vi series, which are sophisticated sorting machines for advanced packaging dies and packages. These integrate vision inspection and other functions for 2D and 3D wafer and package analysis, crucial for applications in smartphones, tablets, wireless wearable devices, Bluetooth, near-field sensing, and various sensor technologies. The Ai series offers precision bonding machines, designed for extra fine pitch with thin dies and substrates, utilized in telecommunications, high-performance computing (GPU and CPU for AI and blockchain), image sensors, and memory applications. Furthermore, the Si series provides final and power test equipment for high-power and fine-pitch devices, essential for electric vehicles and telecommunication systems. Beyond machinery, the company also offers comprehensive maintenance services and technical support for its products, alongside the sale of related spare parts and components. Additionally, it is involved in the production and supply of solder spheres and other essential semiconductor-related materials. Headquartered in Bayan Lepas, Malaysia, the company was formerly known as Mi Equipment Holdings Berhad before adopting its current name in December 2018.