Stock Events

BlackRock iShares USD Asia High Yield Bond (QL3.SG) Dividends 2024

Dividend Yield
7.93%
Dividend amount
S$0.17
Last ex-date
Sep 04, 2024
Last pay date
Sep 30, 2024

Summary

BlackRock iShares USD Asia High Yield Bond (QL3.SG) dividends are paid quarterly. The latest dividend per share was S$0.17 with an ex date of September 04, 2024 and a payment date of September 30, 2024. The next dividend per share will be S$0.16 with an ex date of December 01, 2024 and a payment date of December 29, 2024. The curreny dividend yield of BlackRock iShares USD Asia High Yield Bond (QL3.SG) is 7.93%.

Upcoming

Past

10Y Growth
-1.89%
5Y Growth
-4.29%
3Y Growth
1.17%
1Y Growth
5.17%