TongFu Microelectronics 

Tongfu Microelectronics Co.,Ltd specializes in delivering integrated circuit (IC) packaging and testing solutions for the semiconductor sector. The company provides a comprehensive suite of semiconductor testing services, encompassing wafer probing, strip testing, final validation, and system-level assessments. Furthermore, Tongfu Microelectronics extends its offerings to include specialized test platform and engineering support for a wide array of devices. These devices span analog and mixed-signal components, automotive electronics, radio frequency modules, high-performance computing devices, baseband processors, memory units, LCD drivers, System-in-Package (SiP) solutions, power modules, and various other integrated circuits. Key product categories benefiting from their testing expertise include CPUs, GPUs, gaming consoles, and networking equipment. Established in 1997, Tongfu Microelectronics Co.,Ltd is headquartered in Nantong, China, and adopted its current name in December 2016, having previously operated as Nantong Fujitsu Microelectronics Co., Ltd.