Stock Events

Stock Events

QUALCOMM 325% 20/50 (US747525BJ18.BOND) Dividend 2026: History, Ex-Dividend Dates & Yield

$63.06
+$0.40+0.64%Thursday 00:00
Dividend Yield
5.19%
Dividend amount
-
Last ex-date
-
Last pay date
-

Summary

QUALCOMM 325% 20/50 (US747525BJ18.BOND). Dividend Frequency: semi-annual. The next dividend payment from QUALCOMM 325% 20/50 is estimated for November 20, 2026. Estimated next dividend amount: $1.63. The current dividend yield of QUALCOMM 325% 20/50 is 5.19%.

Upcoming

Nov 20
Dividend Ex
Estimated
 
Nov 20
Dividend Payment
Estimated
 
May 20, 2027
Dividend Ex
Estimated
 
May 20, 2027
Dividend Payment
Estimated
 
Nov 20, 2027
Dividend Ex
Estimated
 
Nov 20, 2027
Dividend Payment
Estimated
 

FAQs

How much dividend does QUALCOMM 325% 20/50 pay?▼
Based on the current price and yield, the annualized dividend estimate for QUALCOMM 325% 20/50 is $3.27 per share.
What is the dividend yield of QUALCOMM 325% 20/50?▼
The current dividend yield of QUALCOMM 325% 20/50 is 5.19%.
When does QUALCOMM 325% 20/50 pay dividends?▼
Dividend Frequency: semi-annual. The next dividend payment from QUALCOMM 325% 20/50 is estimated for November 20, 2026.
When is the next dividend from QUALCOMM 325% 20/50?▼
The next dividend payment from QUALCOMM 325% 20/50 is estimated for November 20, 2026.
How safe is the dividend of QUALCOMM 325% 20/50?▼
QUALCOMM 325% 20/50 has raised its dividend for 5 consecutive years.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in USD.