This list is an analysis based on recent market events. It's not an investment recommendation.
FAQs
What is CLP Power Hong Kong Financing 3375% 12/27 stock price today?▼
The current price of XS0848445358.BOND is $98.56 USD — it has increased by +0% in the past 24 hours. Watch CLP Power Hong Kong Financing 3375% 12/27 stock price performance more closely on the chart.
What is CLP Power Hong Kong Financing 3375% 12/27 stock ticker?▼
Depending on the exchange, the stock ticker may vary. For instance, on Bonds exchange CLP Power Hong Kong Financing 3375% 12/27 stocks are traded under the ticker XS0848445358.BOND.
Is CLP Power Hong Kong Financing 3375% 12/27 stock price growing?▼
XS0848445358.BOND stock has risen by +0.19% compared to the previous week, the month change is a +0.31% rise, over the last year CLP Power Hong Kong Financing 3375% 12/27 has showed a -0.19% decrease.
Does CLP Power Hong Kong Financing 3375% 12/27 pay dividends?▼
Yes, XS0848445358.BOND dividends are paid semi-annual. The last dividend per share was 1.69 . As of today, Dividend Yield (FWD)% is 3.42%.
In which sector is CLP Power Hong Kong Financing 3375% 12/27 located?▼
CLP Power Hong Kong Financing 3375% 12/27 operates in the Other sector.
When did CLP Power Hong Kong Financing 3375% 12/27 complete a stock split?▼
CLP Power Hong Kong Financing 3375% 12/27 has not had any recent stock splits.