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Stock Events

China Wafer Level CSP (603005.SHG) June 2018 Dividend

¥22.55
-¥0.31-1.36%Thursday 00:00
Dividend Yield
0.53%
Dividend amount
¥0.12
¥0.07
Per Share

Announced

Confirmed • April 4, 2018

Ex Date

Reached • June 21, 2018

Pay Date

Paid • June 21, 2018

Description

⁨China Wafer Level CSP⁩ (⁦603005.SHG⁩) has announced a dividend of ⁦¥0.07⁩ with an ex date of June 21, 2018 and a payment date of June 21, 2018. The record date is June 20, 2018.

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