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Stock Events

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) October 2024 Dividend

₩8,160
+₩100+1.24%Friday 00:00
Dividend Yield
5.32%
Dividend amount
₩434
₩37
Per Share

Announced

Confirmed • September 26, 2024

Ex Date

Reached • September 27, 2024

Pay Date

Paid • October 4, 2024

Description

⁨SAMSUNG KODEX US Treasury 20+ Year Bond Active (H)⁩ (⁦484790.KQ⁩) has announced a dividend of ⁦₩37⁩ with an ex date of September 27, 2024 and a payment date of October 4, 2024. The record date is September 30, 2024.

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