Stock Events

Stock Events

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) December 2024 Dividend

₩8,745
+₩60+0.69% Monday 00:00
Dividend Yield
4.54%
Dividend amount
₩396.72
₩30
Per Share

Announced

Confirmed • November 27, 24

Ex Date

Reached • November 28, 24

Pay Date

Paid • December 03, 24

Description

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) has announced a dividend of ₩30 with an ex date of November 28, 2024 and a payment date of December 03, 2024. The record date is November 29, 2024.

Community

0 Comments

Share your thoughts