Stock Events

Stock Events

Chipbond Technology (6147.TWO) August 2013 Dividend

TWD203.00
-TWD10.50-4.92%Thursday 00:00
Dividend Yield
1.38%
Dividend amount
TWD2.80
TWD1.60
Per Share

Announced

Confirmed • April 25, 2013

Ex Date

Reached • August 7, 2013

Pay Date

Paid • August 26, 2013

Description

⁨Chipbond Technology⁩ (⁦6147.TWO⁩) has announced a dividend of ⁦TWD1.60⁩ with an ex date of August 7, 2013 and a payment date of August 26, 2013. The record date is August 8, 2013.

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