Stock Events

Stock Events

Chipbond Technology (6147.TWO) August 2014 Dividend

TWD142.5
+TWD6.5+4.78% Friday 00:00
Dividend Yield
2.76%
Dividend amount
TWD3.93
TWD1.6
Per Share

Announced

Confirmed • April 30, 14

Ex Date

Reached • July 24, 14

Pay Date

Paid • August 20, 14

Description

Chipbond Technology (6147.TWO) has announced a dividend of TWD1.6 with an ex date of July 24, 2014 and a payment date of August 20, 2014. The record date is July 25, 2014.

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