Stock Events

Stock Events

Chipbond Technology (6147.TWO) August 2017 Dividend

TWD142.5
+TWD6.5+4.78% Friday 00:00
Dividend Yield
2.76%
Dividend amount
TWD3.93
TWD2.1
Per Share

Announced

Confirmed • April 28, 17

Ex Date

Reached • July 27, 17

Pay Date

Paid • August 18, 17

Description

Chipbond Technology (6147.TWO) has announced a dividend of TWD2.1 with an ex date of July 27, 2017 and a payment date of August 18, 2017. The record date is July 28, 2017.

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