Stock Events

Stock Events

Chipbond Technology (6147.TWO) August 2018 Dividend

TWD203.00
-TWD10.50-4.92%Thursday 00:00
Dividend Yield
1.31%
Dividend amount
TWD2.66
TWD2.35
Per Share

Announced

Confirmed • May 2, 2018

Ex Date

Reached • July 25, 2018

Pay Date

Paid • August 17, 2018

Description

⁨Chipbond Technology⁩ (⁦6147.TWO⁩) has announced a dividend of ⁦TWD2.35⁩ with an ex date of July 25, 2018 and a payment date of August 17, 2018. The record date is July 26, 2018.

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