Chipbond Technology (6147.TWO) August 2019 Dividend

TWD203.00
-TWD10.50-4.92%Thursday 00:00
Dividend Yield
1.38%
Dividend amount
TWD2.80
TWD3.50
Per Share

Announced

Confirmed • May 6, 2019

Ex Date

Reached • July 25, 2019

Pay Date

Paid • August 19, 2019

Description

⁨Chipbond Technology⁩ (⁦6147.TWO⁩) has announced a dividend of ⁦TWD3.50⁩ with an ex date of July 25, 2019 and a payment date of August 19, 2019. The record date is July 26, 2019.

Community

0 Comments

Share your thoughts