Stock Events

Stock Events

Chipbond Technology (6147.TWO) August 2022 Dividend

TWD142.5
+TWD6.5+4.78% Friday 00:00
Dividend Yield
2.76%
Dividend amount
TWD3.93
TWD0.5
Per Share

Announced

Confirmed • April 18, 22

Ex Date

Reached • July 20, 22

Pay Date

Paid • August 12, 22

Description

Chipbond Technology (6147.TWO) has announced a dividend of TWD0.5 with an ex date of July 20, 2022 and a payment date of August 12, 2022. The record date is July 21, 2022.

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