Stock Events

Stock Events

Chipbond Technology (6147.TWO) July 2023 Dividend

TWD203.00
-TWD10.50-4.92%Thursday 00:00
Dividend Yield
1.38%
Dividend amount
TWD2.80
TWD2.00
Per Share

Announced

Confirmed • February 24, 2023

Ex Date

Reached • June 16, 2023

Pay Date

Paid • July 14, 2023

Description

⁨Chipbond Technology⁩ (⁦6147.TWO⁩) has announced a dividend of ⁦TWD2.00⁩ with an ex date of June 16, 2023 and a payment date of July 14, 2023. The record date is June 19, 2023.

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