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Stock Events

Chipbond Technology (6147.TWO) July 2026 Dividend

TWD136
-TWD8-5.56% Thursday 00:00
Dividend Yield
2.6%
Dividend amount
TWD3.54
TWD3.75
Per Share

Estimated

This is an estimated dividend. The company has not yet announced the real dividend. Please be very careful when using this information.

Ex Date

in 54 days • June 17, 26

Pay Date

in 82 days • July 15, 26

Description

Chipbond Technology (6147.TWO) has announced a dividend of TWD3.75 with an ex date of June 17, 2026 and a payment date of July 15, 2026. The record date is N/A.

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