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Stock Events

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) February 2026 Dividend

₩8,205
+₩30+0.37% Wednesday 00:00
Dividend Yield
5.23%
Dividend amount
₩429
₩36
Per Share

Estimated

This is an estimated dividend. The company has not yet announced the real dividend. Please be very careful when using this information.

Ex Date

Reached • January 30, 26

Pay Date

Paid • February 04, 26

Description

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) has announced a dividend of ₩36 with an ex date of January 30, 2026 and a payment date of February 04, 2026. The record date is N/A.

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