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Stock Events

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) September 2025 Dividend

₩8,710
+₩10+0.11% Friday 00:00
Dividend Yield
4.53%
Dividend amount
₩394.45
₩37
Per Share

Announced

Confirmed • August 27, 25

Ex Date

Reached • August 28, 25

Pay Date

Paid • September 02, 25

Description

SAMSUNG KODEX US Treasury 20+ Year Bond Active (H) (484790.KQ) has announced a dividend of ₩37 with an ex date of August 28, 2025 and a payment date of September 02, 2025. The record date is August 29, 2025.

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