This list is an analysis based on recent market events. It's not an investment recommendation.
FAQs
What is CLP Power Hong Kong Financing 2125% 20/30 stock price today?▼
The current price of XS2193950354.BOND is $89.59 USD — it has increased by +0.22% in the past 24 hours. Watch CLP Power Hong Kong Financing 2125% 20/30 stock price performance more closely on the chart.
What is CLP Power Hong Kong Financing 2125% 20/30 stock ticker?▼
Depending on the exchange, the stock ticker may vary. For instance, on Bonds exchange CLP Power Hong Kong Financing 2125% 20/30 stocks are traded under the ticker XS2193950354.BOND.
Is CLP Power Hong Kong Financing 2125% 20/30 stock price growing?▼
XS2193950354.BOND stock has risen by +0.6% compared to the previous week, the month change is a +1.5% rise, over the last year CLP Power Hong Kong Financing 2125% 20/30 has showed a -1.47% decrease.
Does CLP Power Hong Kong Financing 2125% 20/30 pay dividends?▼
Yes, XS2193950354.BOND dividends are paid semi-annual. The last dividend per share was 1.06 . As of today, Dividend Yield (FWD)% is 2.38%.
In which sector is CLP Power Hong Kong Financing 2125% 20/30 located?▼
CLP Power Hong Kong Financing 2125% 20/30 operates in the Other sector.
When did CLP Power Hong Kong Financing 2125% 20/30 complete a stock split?▼
CLP Power Hong Kong Financing 2125% 20/30 has not had any recent stock splits.