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CLP Power Hong Kong Financing 2125% 20/30 (XS2193950354.BOND) Dividend 2026: History, Ex-Dividend Dates & Yield

$89.59
+$0.20+0.22%Thursday 00:00
Dividend Yield
2.37%
Dividend amount
-
Last ex-date
-
Last pay date
-

Summary

CLP Power Hong Kong Financing 2125% 20/30 (XS2193950354.BOND). Dividend Frequency: semi-annual. The next dividend payment from CLP Power Hong Kong Financing 2125% 20/30 is estimated for December 30, 2026. Estimated next dividend amount: $1.06. The current dividend yield of CLP Power Hong Kong Financing 2125% 20/30 is 2.37%.

Upcoming

Dec 30
Dividend Ex
Estimated
 
Dec 30
Dividend Payment
Estimated
 
Jun 30, 2027
Dividend Ex
Estimated
 
Jun 30, 2027
Dividend Payment
Estimated
 
Dec 30, 2027
Dividend Ex
Estimated
 
Dec 30, 2027
Dividend Payment
Estimated
 

FAQs

How much dividend does CLP Power Hong Kong Financing 2125% 20/30 pay?▼
Based on the current price and yield, the annualized dividend estimate for CLP Power Hong Kong Financing 2125% 20/30 is $2.13 per share.
What is the dividend yield of CLP Power Hong Kong Financing 2125% 20/30?▼
The current dividend yield of CLP Power Hong Kong Financing 2125% 20/30 is 2.37%.
When does CLP Power Hong Kong Financing 2125% 20/30 pay dividends?▼
Dividend Frequency: semi-annual. The next dividend payment from CLP Power Hong Kong Financing 2125% 20/30 is estimated for December 30, 2026.
When is the next dividend from CLP Power Hong Kong Financing 2125% 20/30?▼
The next dividend payment from CLP Power Hong Kong Financing 2125% 20/30 is estimated for December 30, 2026.
How safe is the dividend of CLP Power Hong Kong Financing 2125% 20/30?▼
CLP Power Hong Kong Financing 2125% 20/30 has raised its dividend for 5 consecutive years.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in USD.