CLP Power Hong Kong Financing 225% 21/31
$87.37
0
+$0.05+0.06% 08:19 Today
Statistics
Day High
-
Day Low
-
52W High
91.06
52W Low
85.71
Volume
-
Avg. Volume
-
Mkt Cap
0
P/E Ratio
-
Dividend Yield
2.58%
Dividend
2.25
Upcoming
Dividends
2.58%Dividend Yield
Jul 2026
$1.13
Jan 2026
$1.13
Jul 2025
$1.13
Jan 2025
$1.13
Jul 2024
$1.13
10Y Growth
N/A
5Y Growth
N/A
3Y Growth
N/A
1Y Growth
N/A
Competitors
This list is an analysis based on recent market events. It's not an investment recommendation.
About
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CEO
ISIN
XS2364591367
WKN
A3KT55
Listings
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FAQs
What is CLP Power Hong Kong Financing 225% 21/31 stock price today?▼
The current price of XS2364591367.BOND is $87.37 USD — it has increased by +0.06% in the past 24 hours. Watch CLP Power Hong Kong Financing 225% 21/31 stock price performance more closely on the chart.
What is CLP Power Hong Kong Financing 225% 21/31 stock ticker?▼
Depending on the exchange, the stock ticker may vary. For instance, on Bonds exchange CLP Power Hong Kong Financing 225% 21/31 stocks are traded under the ticker XS2364591367.BOND.
Is CLP Power Hong Kong Financing 225% 21/31 stock price growing?▼
XS2364591367.BOND stock has risen by +0.68% compared to the previous week, the month change is a +1.55% rise, over the last year CLP Power Hong Kong Financing 225% 21/31 has showed a -2.67% decrease.
Does CLP Power Hong Kong Financing 225% 21/31 pay dividends?▼
Yes, XS2364591367.BOND dividends are paid semi-annual. The last dividend per share was 1.13 . As of today, Dividend Yield (FWD)% is 2.58%.
In which sector is CLP Power Hong Kong Financing 225% 21/31 located?▼
CLP Power Hong Kong Financing 225% 21/31 operates in the Other sector.
When did CLP Power Hong Kong Financing 225% 21/31 complete a stock split?▼
CLP Power Hong Kong Financing 225% 21/31 has not had any recent stock splits.