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CLP Power Hong Kong Financing 225% 21/31 (XS2364591367.BOND) Dividend 2026: History, Ex-Dividend Dates & Yield

$87.32
-$0.05-0.06%Wednesday 00:00
Dividend Yield
2.58%
Dividend amount
-
Last ex-date
-
Last pay date
-

Summary

CLP Power Hong Kong Financing 225% 21/31 (XS2364591367.BOND). Dividend Frequency: semi-annual. The next dividend payment from CLP Power Hong Kong Financing 225% 21/31 is estimated for January 21, 2027. Estimated next dividend amount: $1.13. The current dividend yield of CLP Power Hong Kong Financing 225% 21/31 is 2.58%.

Upcoming

Jan 21, 2027
Dividend Ex
Estimated
 
Jan 21, 2027
Dividend Payment
Estimated
 
Jul 21, 2027
Dividend Ex
Estimated
 
Jul 21, 2027
Dividend Payment
Estimated
 
Jan 21, 2028
Dividend Ex
Estimated
 
Jan 21, 2028
Dividend Payment
Estimated
 

FAQs

How much dividend does CLP Power Hong Kong Financing 225% 21/31 pay?▼
Based on the current price and yield, the annualized dividend estimate for CLP Power Hong Kong Financing 225% 21/31 is $2.25 per share.
What is the dividend yield of CLP Power Hong Kong Financing 225% 21/31?▼
The current dividend yield of CLP Power Hong Kong Financing 225% 21/31 is 2.58%.
When does CLP Power Hong Kong Financing 225% 21/31 pay dividends?▼
Dividend Frequency: semi-annual. The next dividend payment from CLP Power Hong Kong Financing 225% 21/31 is estimated for January 21, 2027.
When is the next dividend from CLP Power Hong Kong Financing 225% 21/31?▼
The next dividend payment from CLP Power Hong Kong Financing 225% 21/31 is estimated for January 21, 2027.
How safe is the dividend of CLP Power Hong Kong Financing 225% 21/31?▼
CLP Power Hong Kong Financing 225% 21/31 has raised its dividend for 3 consecutive years.
In which currency is the dividend history shown?▼
Dividend history amounts are shown in USD.