AMKOR Technology 

$85.44
473
+$2.66+3.21% 今天

統計

當日最高
88.64
當日最低
82.61
52週高點
88.64
52週低點
19.79
成交量
5,980,652
平均成交量
4,664,787
市值
21.13B
本益比
47.57
股息殖利率
0.4%
股息
0.34

即將到來

股息

0.4%股息殖利率
Jun 26
$0.08
Mar 26
$0.08
Dec 25
$0.08
Sep 25
$0.08
Jun 25
$0.08
10年成長
不適用
5年成長
14.47%
3年成長
3.22%
1年成長
0.75%

財報

3Aug預期
Q4 2024
Q1 2025
Q2 2025
Q3 2025
Q4 2025
Q1 2026
下一步
0.09
0.29
0.49
0.69
預期EPS
0.474043
實際EPS
不適用

財務

5.57%利潤率
有盈利
2020
2021
2022
2023
2024
2025
13.42B營收
747.79M淨利

分析師評級

69.00平均目標價
最高預估為 90.00。
來自過去6個月內的 6 則評分。這不是投資建議。
買入
33%
持有
67%
賣出
0%

其他人也在關注

此清單是根據在 Stock Events 上追蹤 AMKR 的使用者自選建立的。這不是投資建議。

競爭對手

此清單為基於近期市場事件的分析。並非投資建議。

關於

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
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執行長
Ms. Susan Y. Kim
員工
28300
國家
美國
ISIN
US0316521006

上市

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FAQ

AMKOR Technology 今天的股價是多少?
AMKR 目前價格為 $85.44 USD,過去 24 小時上漲了 +3.21%。在圖表上更密切關注 AMKOR Technology 股價表現。
AMKOR Technology 的股票代號是什麼?
根據交易所不同,股票代號可能會有所差異。例如,在 交易所,AMKOR Technology 的股票以代號 AMKR 進行交易。
AMKOR Technology 的股價在上漲嗎?
AMKR 股票較上週上漲 +25.11%,本月上漲 +21.45%,過去一年 AMKOR Technology 上漲 +329.56%。
AMKOR Technology 的市值是多少?
今天 AMKOR Technology 的市值為 21.13B
AMKOR Technology 下一次財報日期是什麼時候?
AMKOR Technology 將於 August 03, 2026 公布下一次財報。
AMKOR Technology 上一季度的財報如何?
AMKR 上一季度的財報為每股 0.33 USD,預估為 0.24 USD,帶來 +37.65% 的驚喜。下一季度的預估財報為每股 不適用 USD。
AMKOR Technology 去年的營收是多少?
AMKOR Technology 去年的營收為 13.42BUSD。
AMKOR Technology 去年的淨利是多少?
AMKR 去年的淨收益為 747.79MUSD。
AMKOR Technology 會發放股息嗎?
是的,AMKR 的股息每 每季 發放一次。每股最新股息為 0.08 USD。截至今日,股息殖利率(FWD)% 為 0.4%。
AMKOR Technology 有多少名員工?
截至 June 15, 2026,公司共有 28,300 名員工。
AMKOR Technology 位於哪個產業?
AMKOR Technology從事於Technology產業。
AMKOR Technology 何時完成拆股?
AMKOR Technology 最近沒有進行任何拆股。
AMKOR Technology 的總部在哪裡?
AMKOR Technology 的總部位於 美國 的 Tempe。